
Automatic Optical inspection of solder joints, component errors, leaks and virtual welds
PCB is the core carrier of electronic products. Machine vision uses Automatic Optical Inspection (AOI) to identify defects such as solder joints, component errors and omissions, false welds, and bridges. It relies on the AI algorithm Platform to reduce false positives and ensure the welding quality of the motherboard.

AOI inspection of solder joints, bridges, and virtual welds
Identification of component leakage and reverse polarity connection
AI Algorithm Platform reduces false positives
2.5D Inspection presents solder joint three-dimensional morphology
Appearance and assembly accuracy inspection of shell, middle frame, and screen module
Identification of defects on gold surfaces, characters and broken lines of flexible wiring boards
Verbatim reading and tracing of serial number, QR code and nameplate
Sub-pixel level size measurement, suitable for precision Mechanical parts tolerance control
3D visually guides flexible loading, unloading and assembly of shaped parts
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