Application ·Industry Applications

Semiconductor & IC ·Machine vision solution

High-precision visual solutions for wafer defect detection, chip package alignment, and lead frame positioning.

Wafer defect detection Package alignment Lead frame positioning Subpixel measurement BGA ball planting detection

Industry overview

OVERVIEW

In semiconductor and integrated circuit manufacturing, machine vision undertakes key processes such as wafer surface defect detection, lithography alignment, packaging lead frame positioning, and BGA ball implantation inspection. Chuanghua Research provides HIKROBOT High Resolution Area/Line Array Cameras, Telecentric Lenses and Professional Light Source, which are combined with the VM algorithm Platform to achieve sub-pixel measurement, meeting the strict requirements for accuracy and stability in clean workshops.

Wafer defect detection Package alignment Lead frame positioning Subpixel measurement BGA ball planting detection

Application scenario coverage

SCENARIOS

Integrated circuits

Previous wafer

Subpixel detection of wafer surface particles, scratches and lithography alignment

Rear packaging

High-speed detection of pin coplanarity, BGA ball placement and character AOI

Lead frame

Lead frame positioning, coating defects and appearance identification

High-precision measurement

Telecentric imaging

Telecentric Lenses + Custom Light Source enables fluoroscopic Distortion measurement

VM Algorithm Platform

Complete complex defect determination based on self-developed algorithm Platform

Typical plan

TYPICAL SOLUTIONS

Total 2

Visual inspection of wafers and chips

High-precision inspection solutions for wafer surface defects, lithography alignment and packaging lead frame positioning.

adopts a high Resolution area array/line array Camera with Telecentric Lenses and custom Light Source to achieve sub-pixel level measurement based on the VM algorithm Platform, covering key processes such as wafer defects, BGA ball implantation, and lead frame positioning.

Get plan information

Semiconductor packaging AOI

Automatic Optical inspection plan for appearance defects and character recognition in the packaging process.

For sealing and testing lines, a combination of Smart Cameras and 3D Profile Sensors is provided to achieve high-speed detection of pin coplanarity, character barcodes and appearance defects.

Get plan information