Application ·Industry Applications

3C Electronics ·Machine vision solution

Precision assembly, appearance defect detection, barcode traceability and identification.

Precision AOI testing Micro parts size measurement Barcode traceability Appearance defect identification Flexible assembly guidance

Industry overview

OVERVIEW

serves electronic manufacturing such as mobile phones, PCBs, and semiconductors, covering precision assembly guidance, appearance AOI and full-process traceability.

Precision AOI testing Micro parts size measurement Barcode traceability Appearance defect identification Flexible assembly guidance

Application scenario coverage

SCENARIOS

Consumer Electronics

Mobile phone/notebook assembly

Appearance and assembly accuracy inspection of shell, middle frame, and screen module

PCB inspection

Automatic Optical inspection of solder joints, component errors, leaks and virtual welds

FPC testing

Identification of defects on gold surfaces, characters and broken lines of flexible wiring boards

Character recognition

Verbatim reading and tracing of serial number, QR code and nameplate

Precision manufacturing

Micro parts measurement

Sub-pixel level size measurement, suitable for precision Mechanical parts tolerance control

Assembly guidance

3D visually guides flexible loading, unloading and assembly of shaped parts

Typical plan

TYPICAL SOLUTIONS

Total 1

3C Electronic AOI Testing

Automatic determination of PCB solder joints and appearance defects.

Based on Smart Cameras and deep learning, automatic identification of PCB solder joints, component errors, omissions, and appearance defects is completed.

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