
Silicon wafer sorting, cell inspection, component layout and defect identification.
covers the entire process of inspection of silicon wafers, cells and components, helping to improve the quality and efficiency of the Photovoltaic production line.

Consistent sorting of silicon wafer line traces, chipping edges and thickness
Accurate identification of hidden cracks, broken grids, black spots and color differences
Detection of battery cell layout misalignment and hidden crack defects before lamination
Hidden cracks, broken grids and color differences identification.
Integrate brightfield/darkfield imaging with AI algorithms to accurately identify cell cracks, broken grids and chromatic aberration defects.
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Highly sensitive imaging identifies micro-cracks and broken grids to improve yield.

Online interception of typesetting mismatches and hidden cracks before lamination.

Line array imaging completes the automatic sorting of silicon wafer line traces and chipping edges.
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