
Consistent sorting of silicon wafer line traces, chipping edges and thickness
Silicon wafer quality is the basis for battery efficiency. Machine vision consistently sorts silicon wafer line traces, chipping edges, thickness and warpage to eliminate defective incoming materials and ensure the stability of the subsequent process.

Silicon wafer line marks, chipping edges and missing corners identification
Thickness and warpage consistency sorting
High-speed sorting adapts to the trend of slicing
Sorting data back to MES
Accurate identification of hidden cracks, broken grids, black spots and color differences
Detection of battery cell layout misalignment and hidden crack defects before lamination
Electroluminescence and photoluminescence imaging reveals internal cracks
AI classification ensures consistency of component appearance color differences
Scan the QR code and add customer service WeChat
