APPLICATION · Integrated circuits

Lead frame ·Machine vision solution

Lead frame positioning, coating defects and appearance identification

Scene overview

OVERVIEW

Lead frame positioning and coating quality affect package yield. Machine vision completes frame positioning, coating defects and appearance identification to ensure the accuracy of post-bonding and packaging.

Wafer defect detection Package alignment Lead frame positioning Subpixel measurement BGA ball planting detection

Core competencies

KEY CAPABILITIES

High-precision positioning of lead frame

Coating defects and appearance identification

Real-time full inspection of high-speed production lines

Defect coordinates are traced back

Recommended products

Other application scenarios in the same industry

MORE SCENARIOS

Previous wafer

Subpixel detection of wafer surface particles, scratches and lithography alignment

Rear packaging

High-speed detection of pin coplanarity, BGA ball placement and character AOI

Telecentric imaging

Telecentric Lenses + Custom Light Source enables fluoroscopic Distortion measurement

VM Algorithm Platform

Complete complex defect determination based on self-developed algorithm Platform

Need "Lead frame "?

Provide selection consultation, sample testing and solution verification, and original factory authorization support.

Obtaining solutions