APPLICATION · Integrated circuits

Rear packaging ·Machine vision solution

High-speed detection of pin coplanarity, BGA ball placement and character AOI

Scene overview

OVERVIEW

Post-packaging determines chip reliability and solderability. Machine vision completes high-speed AOI inspection of pin coplanarity, BGA ball placement, characters and appearance, and adapts to multiple types of packages.

Wafer defect detection Package alignment Lead frame positioning Subpixel measurement BGA ball planting detection

Core competencies

KEY CAPABILITIES

3D measurement of pin coplanarity

BGA ball implant missing ball and offset detection

Silkscreen characters and appearance AOI

AI Platform reduces false positives

Recommended products

Other application scenarios in the same industry

MORE SCENARIOS

Previous wafer

Subpixel detection of wafer surface particles, scratches and lithography alignment

Lead frame

Lead frame positioning, coating defects and appearance identification

Telecentric imaging

Telecentric Lenses + Custom Light Source enables fluoroscopic Distortion measurement

VM Algorithm Platform

Complete complex defect determination based on self-developed algorithm Platform

Need "Rear packaging "?

Provide selection consultation, sample testing and solution verification, and original factory authorization support.

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