APPLICATION · Integrated circuits

Previous wafer ·Machine vision solution

Subpixel detection of wafer surface particles, scratches and lithography alignment

Scene overview

OVERVIEW

Previous wafer manufacturing requires extreme cleanliness and accuracy. Machine vision uses sub-pixels to detect particles, scratches and lithography alignment on the wafer surface to ensure process yield and overlay accuracy.

Wafer defect detection Package alignment Lead frame positioning Subpixel measurement BGA ball planting detection

Core competencies

KEY CAPABILITIES

Subpixel detection of particles and scratches on wafer surface

Determination of lithography alignment and overlay accuracy

High-resolution imaging adapts nanoscale features

Non-contact testing ensures cleanliness

Recommended products

Other application scenarios in the same industry

MORE SCENARIOS

Rear packaging

High-speed detection of pin coplanarity, BGA ball placement and character AOI

Lead frame

Lead frame positioning, coating defects and appearance identification

Telecentric imaging

Telecentric Lenses + Custom Light Source enables fluoroscopic Distortion measurement

VM Algorithm Platform

Complete complex defect determination based on self-developed algorithm Platform

Need "Previous wafer "?

Provide selection consultation, sample testing and solution verification, and original factory authorization support.

Obtaining solutions